Microcosm's Innovative Product Lineup at TPCA Show
Microcosm is set to showcase its cutting-edge products designed specifically for the printed circuit board (PCB) and electronics manufacturing industries at the TPCA Show. organized by the Taiwan Printed Circuit Association (TPCA), this annual exhibition is one of Asia's leading events for professionals in the electronics manufacturing and PCB sectors.
At the TPCA Show, Microcosm's launched a series of innovative products, offering advanced solutions for a wide range of applications, showcasing its commitment to innovation in the high-tech sector. These products include Liquid-type Negative Photosensitive PI Protective Resin, Liquid-type High-Temperature Peelable Photosensitive Polyimide Material, Peelable Polyimide Adhesive for Selective Electroless Plating, White Photosensitive Solder Mask Ink, and Transparent Laminates.
Liquid-type Negative Photosensitive PI Protective Resin
Liquid-type Negative Photosensitive PI Protective Resin is an integrated material that combines CVL, PSR, bending, and hole filling. This UL-certified, polyimide-based material is suitable for flexible, rigid, and rigid-flex boards. It offers excellent resolution, thermal resistance, thinning, flexibility, and process simplification and can be applied as a photosensitive protective layer, interlayer insulating layer, or flexible solder mask photosensitive layer.
Liquid-type High-Temperature Peelable Photosensitive Polyimide Material
Liquid-type High-Temperature Peelable Photosensitive Polyimide Material is a high-performance solution for embedded structures, inner layer circuit protection, and gold finger protection with step filling. It offers excellent heat resistance, small-scale high-precision protection, and compatibility with direct printing, photosensitive development, and high-temperature lamination processes without cracking.
Peelable Polyimide Adhesive for Selective Electroless Plating
Peelable Polyimide Adhesive for Selective Electroless Plating is perfect for protecting multiple gold-plated pads/fingers in fine pattern areas. It exhibits strong resistance to electroless gold and nickel and is suitable for multiple gold plating processes. This adhesive can be coated, printed, and photosensitive-developed.
White Photosensitive Solder Mask Ink
White Photosensitive Solder Mask Ink is a versatile solution for achieving uniform thickness control in PCB fabrication. This liquid ink form is compatible with coating equipment and provides high reflectivity, low yellowing, fine resolution, and bendability without cracking.
Transparent Laminates
Transparent Laminates are designed to meet the demanding requirements of ultra-fine circuit production, flexible displays, Metal Mesh, transparent LEDs, and wearable devices. These laminates provide uniform metal film thickness, low optical variation, high heat resistance, excellent peel strength, flexibility, and ultra-thin characteristics.
By showcasing these advanced products at the TPCA Show, Microcosm aims to connect with industry professionals seeking innovative materials and solutions for their next-generation devices. Attendees can look forward to discovering how Microcosm's products can revolutionize their electronics manufacturing processes and enhance the performance of their products.
Exhibition Period: October 26th (Wed) ~ October 28th (Fri), 2022
Booth no. N623 (4F)
Location: Taipei Nangang Exhibition Hall 1, Hall 4F
