Liquid Photosensitive PI Insulation Protective Material

產品描述：SLB00-GS/SLY00-GS is a type of photosensitive polyimide (PSPI) material that belongs to the category of photosensitive dielectric/passivation materials. Incorporating SLB00-GS/SLY00-GS photosensitive polyimide in the production of electronic products can result in significant cost savings, improved yield, and simplified processes. If you are a manufacturer seeking to develop high-precision circuits in electronic products, consider using SLB00-GS/SLY00-GS to achieve outstanding thermal stability, excellent mechanical properties, and high photosensitivity. Contact us now to learn more about how this material can help you achieve your product development goals.

產品介紹

Product Description

Microcosm Technology's SLB00-GS/SLY00-GS is a photosensitive polyimide (PSPI) material designed for the photodielectric insulation needs of the electronics industry. It demonstrates superior characteristics whether used in flexible, rigid, or rigid-flex boards. This material is available in yellow and matte black to meet various process requirements.

With the ongoing trend of miniaturization in electronics, the demand for micro-circuitry and high-precision layering technology is increasing. This leads to stricter requirements for material performance. Incorporating Microcosm Technology's photosensitive polyimide materials into the production of consumer electronics provides a vital opportunity to achieve high-quality performance, effectively streamline processes, increase efficiency, and reduce production costs.

Contact us now to learn how the excellent thermal stability, mechanical properties, and high photosensitivity of SLB00-GS/SLY00-GS materials can help you achieve your electronics development goals.

Product Features

Microcosm's SLB00-GS/SLY00-GS features include high insulation, excellent thermal stability, strong mechanical properties, chemical resistance, and photosensitivity, all of which are key performance requirements in the PCB printed circuit board industry.

Versatile applications: Can be used as a photoimageable cover layer, interlayer dielectric, or flexible solder mask, effectively providing protection and insulation.
Exceptional insulation: Exhibits excellent anti-ion migration characteristics for over 1000 hours under 35um/35um conditions.
Flexibility: Offers low rebound and high bend resistance, ensuring stability of the circuit boards in various environments.
Flexible processing: Can be screen printed or coated, and for even more efficient operation, Microcosm's patented dual-sided coater can be used.
High-precision manufacturing: Meets the application requirements for dimensional accuracy less than 0.1%.
Quality exposure and development: DI exposure and development technology ensure high precision of the circuits.
Integrated solutions: A material that combines the functions of protective film, PSR photoimageable ink, and thermoset ink, providing a one-stop solution that can effectively fill gaps, simplify processes, and reduce manufacturing costs, making it an excellent choice for electronic product manufacturing.