Liquid Photosensitive PI Insulation Protective Material (SLB00-G/SLY00-G)

產品描述：Product Description: SLB00-G* / SLY00-G* is a photosensitive polyimide (PSPI) material specifically designed to meet the dielectric insulation needs of the electronics industry. Whether used in flexible circuits, rigid boards, or rigid-flex boards, it demonstrates excellent performance. The material is available in yellow and matte black to accommodate various processing requirements.

產品介紹

As electronic miniaturization continues to advance, the demand for high-precision multilayer interconnection technology is also rising—resulting in increasingly stringent requirements for material performance.

Introducing Microcosm Technology’s photosensitive polyimide (PSPI) into consumer electronics manufacturing presents a key opportunity to achieve high-performance, streamlined processing, improved efficiency, and lower production costs.

Contact us to learn how SLB00-G* / SLY00-G* can help you meet your electronic product development goals with outstanding thermal stability, mechanical strength, and high photosensitivity.

Key Features

Microcosm SLB00-G* / SLY00-G* offers the critical performance attributes required in the PCB industry, including high insulation, thermal stability, mechanical strength, chemical resistance, and photosensitivity.

Versatile Applications: Functions as a photosensitive protective layer, interlayer dielectric, or flexible solder mask, delivering both insulation and protection.
Outstanding Insulation: Maintains ion migration resistance >1000 hours under 35 µm / 35 µm conditions.
Flexibility: Provides low rebound and high bend resistance, ensuring circuit board stability in a variety of environments.
Adaptable Processing: Compatible with screen printing or coating methods. For enhanced efficiency, we offer a patented dual-sided coating system.
High Precision Manufacturing: Supports applications requiring dimensional accuracy < 0.1%.
Superior Imaging and Development: DI exposure and development ensure high-definition circuit patterning.
Integrated Solution: Combines the functionality of protective films, PSR photoresist inks, and thermosetting inks into a single material—offering a one-stop solution that levels step height, simplifies processing, and reduces cost, making it an ideal choice for advanced electronics manufacturing.

Technical Specifications

Test Item	Test Method / Condition	Unit	SLY00-G* / SLB00-G*
Resolution (6–8 µm thick)	Square / Round Openings	µm	30
Line Width (Solder Mask Bridge)		µm	30
Peel Strength	MPBV / Core Adhesion (cross-cut test)	N/A	100 / 100
	Plated Cu / MPBV	kg/cm	>0.5
Thermal Properties	Solder Resistance (IPC-TM-650 2.4.13, 320°C, 10s × 3 cycles)	N/A	PASS
Chemical Resistance	10% HCl @ 25°C (10 min dip)	N/A	No delamination or penetration
	10% NaOH @ 25°C (10 min dip)	N/A	No delamination or penetration
Electrical Properties	Insulation Strength (IPC-TM-650 2.5.6.1)	kV	>1.5
	Surface Resistivity (IPC-TM-650 2.5.17)	Ω	2.27 × 10¹⁶
	Volume Resistivity	Ω·cm	6.46 × 10¹⁷
Ion Migration Resistance	CAF (35 µm / 35 µm @ 85°C / 85% RH, DC 50V)	HR	>1000 (≥10¹⁰ Ω)
	B-HAST (130°C / 85% RH, DC 10V)	HR	>192 (≥10¹⁰ Ω)