Product Features
1. Easy Removal with No Residue
Easily removable using standard alkaline solutions, ensuring clean, residue-free pads.
2. Photosensitive
Ideal for applications requiring precise protection in small areas
3. High-Temperature Compression Resistant
Maintains shape and stability under high-temperature and high-pressure conditions.
Withstands five cycles of 230 °C for 1.5 hours without diffusion or deformation, and can tolerate temperatures above 320 °C.
4. Flexible Thickness Control
Printing thickness can be adjusted according to the structural protection requirements of the product.
Applications
l Cavity Packaging Structures: Protects embedded pads from contamination.
l Multilayer Board Copper Plating Isolation
l Gold Finger Protection
l Step-Leveling and Filling for Rigid-Flex Board Lamination
Product Type & Specific Applications
SLY00-P* Series
l Non-reactive with PP, suitable for resist mask, copper pad, circuit, and finger protection
l Alkaline/degreasing resistant, can replace PI tape, ideal for protection during the brown oxide process
Product Specification
Item | Condition | Unit | SLY00-P* |
Coating Thickness | Screen Printing | μm | 20–100 |
Pre-baking Condition | Temperature | °C | 90 |
Time | min | 9–10 | |
Exposure Condition | Wavelength (365/385/405 nm) | mJ/cm² | 200–500 |
Developing Condition | 1% K₂CO₃ (or Na₂CO₃) at 30 °C | sec | 60–120 |
Resolution | Round hole / Line width | μm | 100 |
律勝台灣總公司：台南市善化區南科九路8號
聯絡電話：(886)-6-5050662
傳真電話：(886)-6-5050672
台灣區業務：(886)-6-5050662 ext. 507
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律勝蘇州廠：江蘇省蘇州工業園區蘇虹中路45號
聯絡電話：(86)-512-8818-1166
傳真電話：(86)-512-8187-8043
中國區業務：(86)-512-88181166 ext. 8443
