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Alkali-Soluble Peelable PI

產品描述:Used for inner layer pad and step finger protection in multilayer and rigid-flex boards. The industry often uses tape, peelable blue glue, or PI film for protection. Microcosm Technology's photosensitive, heat-resistant temporary protective adhesive can be directly printed, photoimaged, and withstand high temperatures through multiple press cycles without sticking to FPCs. It can be removed with a standard alkaline cleaning process, leaving no residue on the pad surface, making it easy to handle.

Product Featuresimage.png

  • Easily removed via standard alkaline wash, leaving solder pads clean

  • Supports direct printing and photoresist exposure

  • Stable in high-temp lamination without cracking

  • Photosensitive: ideal for precise protection in small regions

  • Designed for Cavity encapsulation, Inner circuit trace integration, Gold finger safeguarding, and Step gap filling

  • Thermal resilience up to 320℃+

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Product Specification

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