Product Description
• Optimized for Precision Patterns: Ideal for processes requiring multiple solder pad/finger protections.
• Withstands nickel-gold process without delamination, ideal for repeated gold plating applications.
• Versatile Application: Suitable for coating, printing, and photosensitive imaging.
Product Features
Product Specification
For more product information or detailed specifications, please contact us.
律勝台灣總公司：台南市善化區南科九路8號
聯絡電話：(886)-6-5050662
傳真電話：(886)-6-5050672
台灣區業務：(886)-6-5050662 ext. 507
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律勝蘇州廠：江蘇省蘇州工業園區蘇虹中路45號
聯絡電話：(86)-512-8818-1166
傳真電話：(86)-512-8187-8043
中國區業務：(86)-512-88181166 ext. 8443
