Product Applications
With the continuous development of foldable devices, the demand for ultra-thin, low-crease, and bendable cover layer solutions has become increasingly important. Microcosm Technology is a trusted innovator in flexible electronics, with deep expertise in high-performance PI materials.
Our ultra-thin composite cover plate—featuring a combination of transparent PI and UTG—is built upon our proprietary core technology: transparent PI, which is fully developed and manufactured in-house by Miccrocosm. We provide patented and proprietary technologies to support unique design requirements.
Our high-performance transparent PI + UTG solution is engineered to enable thinner, more flexible, impact-resistant foldable devices with optimized crease control, surpassing the performance of conventional PET + UTG cover layers.
Product Features
Combines ultra-thin design with excellent impact resistance — 50% thinner than typical PET + UTG cover layers on the market, with superior impact performance
Crease depth < 10 μm
Excellent bendability — passes 200,000 inward bends at R1.5 mm
Product Performance
| Test Item | Microcosm Transparent Composite Cover window (Thickness < 100 μm) | Conventional PET Cover Window (Thickness > 150 μm) |
|---|---|---|
Pen Drop Test Height (12.8g pen, 0.5 mm rounded tip) | > 20 cm | ~10 cm |
Ball Drop Test Height (32.6g steel ball, 20 mm radius) | > 60 cm | ~50 cm |
Crease Depth (measured within 5 mins after 12hr static bend) | < 10 μm | > 20 μm |
If you need product-related information or detailed specifications, please contact us.
律勝台灣總公司：台南市善化區南科九路8號
聯絡電話：(886)-6-5050662
傳真電話：(886)-6-5050672
台灣區業務：(886)-6-5050662 ext. 507
---------------------------------------------
律勝蘇州廠：江蘇省蘇州工業園區蘇虹中路45號
聯絡電話：(86)-512-8818-1166
傳真電話：(86)-512-8187-8043
中國區業務：(86)-512-88181166 ext. 8443
