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High-Frequency Cover Layer

5G High-Speed FPC Material

產品描述：Product Description: AF* is a high-performance, anti-ion migration adhesive film designed for high-frequency applications. It features a low dielectric constant and low dielectric loss, making it ideal for 5G circuitry. This protective adhesive film is designed for bonding with various FCCLs, copper foils, and insulating films.
產品介紹

Product Features

  • Suitable for high-frequency applications with low signal loss

  • Excellent dimensional stability


Product Performance

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For more product information or detailed specifications, please contact us.

 

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