Product Description:
The product is an adhesive for various copper foil substrates (FCCL), copper foils, or insulating film materials. It features excellent resistance to ion migration.
Product Features
● Resistance to ion migration: DC 100V 85℃/85% > 1000 HR
● Low dielectric loss: Low Dk & Df
● Good dimensional stability, does not age or crack with multiple pressings and bendings
● UL-certified product
● Compliant with Reach environmental regulations
● Meets RoHS requirements
● Compatible with existing FPC processes and equipment
Product Specification