Product Features

• Flexible build-up material suitable for mSAP applications

• High-temperature resistant; maintains flexibility and durability after multiple lamination cycles without aging or cracking

• Excellent resistance to ionic migration: DC 100V, 85 °C / 85% RH > 1000 hours

• Low dielectric constant (Dk) and dissipation factor (Df); low water absorption

• Compatible with direct metallization processes — supports electroless and electroplating copper build-up

Product Performance