Negative-Type Photosensitive Polyimide_Negative-Type Photosensitive Polyimide

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Negative-Type Photosensitive Polyimide

產品描述：Product Description: A liquid photosensitive dielectric insulating material used in Wafer Level Package (WLP) processes, suitable for Redistribution Layer (RDL) fabrication.

產品介紹

Product Features

Low-temperature curing: cure temperature 200°C
Low coefficient of thermal expansion (CTE) < 40 ppm/°C
High development resolution

Product Specifications

Test Item	Unit	WLPT01-B
Exposure / Development	/	/
Exposure Dose	mJ/cm²	150–200
Developer	-	CPN (Cyclopentanone) / PGMEA
Resolution (Film Thickness / Via)	µm	10 / 10
Cure Conditions
Cure Temperature	°C	200
Thermal Properties
Glass Transition Temperature (Tg)	°C	>200
Coefficient of Thermal Expansion (CTE)	ppm/K	<40