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Negative-Type Photosensitive Polyimide

產品描述:The product is a liquid photosensitive dielectric material used in the Wafer Level Package (WLP) process, suitable for single-layer or dual-layer redistribution.

Microcosm Technology proudly presents our Negative-Type Photosensitive Polyimide, specifically engineered to meet the stringent demands of the electronics industry and ideally suited for advanced wafer-level packaging (WLP) applications. Our unique formulation offers a remarkable combination of properties that optimize device performance, reliability, and durability.


Discover the exceptional features of Microcosm Technology's Negative-Type Photosensitive Polyimide:

  1. Low-Temperature Curing: Our Negative-Type Photosensitive Polyimide boasts low-temperature curing properties,making it the perfect choice for applications that require minimal thermal exposure during processing. This feature ensures compatibility with a wide range of manufacturing processes and reduces the risk of damage to delicate      components.

  2. Low Coefficient of Thermal Expansion (CTE): Experience excellent dimensional stability and minimized component deformation and stress during temperature fluctuations with our low CTE Negative-Type Photosensitive Polyimide.This attribute contributes to improved device reliability and lifespan.

  3. High Resolution Patterning: Achieve precise and intricate patterns for advanced electronic applications with the superior resolution of our Negative-Type Photosensitive Polyimide. This feature enables the creation of finer, more complex structures to meet the needs of cutting-edge technologies.

  4. Excellent Thermal Stability: Our photosensitive polyimide possesses high thermal stability and a high glass transition temperature (Tg), ensuring exceptional performance in high-temperature environments and demanding applications.

  5. Strong Mechanical Properties: Microcosm Technology's Negative-Type Photosensitive Polyimide demonstrates outstanding mechanical properties, such as high modulus and tensile strength, ensuring the durability and reliability of your devices.

  6. Unlock the full potential of your wafer-level packaging applications with Microcosm Technology's Negative-Type Photosensitive Polyimide. Contact us today to learn more about how our innovative polyimide can revolutionize your WLP processes.



產品特性 

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