Negative-Type Photosensitive Polyimide

Microcosm Technology proudly presents our Negative-Type Photosensitive Polyimide, specifically engineered to meet the stringent demands of the electronics industry and ideally suited for advanced wafer-level packaging (WLP) applications. Our unique formulation offers a remarkable combination of properties that optimize device performance, reliability, and durability.

Discover the exceptional features of Microcosm Technology's Negative-Type Photosensitive Polyimide:

1. Streamlined Processing: Simplify your manufacturing process with our photosensitive polyimide, which can be directly patterned using photolithography. This efficient process eliminates the need for additional photosensitive layers or photoinitiators, reducing time and cost.

2. Low-Temperature Curing: Our Negative-Type Photosensitive Polyimide boasts low-temperature curing properties,making it the perfect choice for applications that require minimal thermal exposure during processing. This feature ensures compatibility with a wide range of manufacturing processes and reduces the risk of damage to delicate      components.

3. Low Coefficient of Thermal Expansion (CTE): Experience excellent dimensional stability and minimized component deformation and stress during temperature fluctuations with our low CTE Negative-Type Photosensitive Polyimide.This attribute contributes to improved device reliability and lifespan.

4. High Resolution Patterning: Achieve precise and intricate patterns for advanced electronic applications with the superior resolution of our Negative-Type Photosensitive Polyimide. This feature enables the creation of finer, more complex structures to meet the needs of cutting-edge technologies.

5. Excellent Thermal Stability: Our photosensitive polyimide possesses high thermal stability and a high glass transition temperature (Tg), ensuring exceptional performance in high-temperature environments and demanding applications.

6. Strong Mechanical Properties: Microcosm Technology's Negative-Type Photosensitive Polyimide demonstrates outstanding mechanical properties, such as high modulus and tensile strength, ensuring the durability and reliability of your devices.

7. Unlock the full potential of your wafer-level packaging applications with Microcosm Technology's Negative-Type Photosensitive Polyimide. Contact us today to learn more about how our innovative polyimide can revolutionize your WLP processes.
   

產品特性 

如需產品相關資料或詳細規格，請與我們聯繫。