Positive - Photosensitive Polybenzoxazole (P-PSPBO)

產品描述：Product Description: High-Resolution, Low-Dielectric-Loss P-PSPBO (Positive Photosensitive Polybenzoxazole) ➠Specifically designed for semiconductor packaging and dielectric insulation applications, offering high resolution, high heat resistance, low moisture absorption, and low dielectric constant.

產品介紹

Product Advantages

◆ PFAS-free material, compliant with EU regulations

◆ Low-temperature curing (<200°C), reducing thermal load during packaging processes and supporting carbon reduction initiatives

◆ Taper angle > 70°, enhancing stability in multi-layer structures for advanced packaging and RDL processes

◆ Low dielectric loss (Df < 0.01 @ 10 GHz), ensuring minimal signal loss for high-speed transmission and improved computing performance, suitable for VCSEL and other optical communication components

◆ High development resolution: film/via = 5 µm / 5 µm, 10 µm / 10 µm

◆ Excellent chemical resistance: effectively resists various organic solvents, alkaline solutions, and other corrosive chemicals

Product Specifications

Test Item		Unit	WLPT01-B
Exposure/Development /Resolution	Exposure Dose	mJ/cm²	350~550
	Developer	-	2.38% TMAH
	Resolution (Film/Via)	um	10 / 5；10 / 10
Cure Conditions	Cure temperature	℃	250~300
Thermal Properties	Tg	℃	＞300
Thermal Properties	CTE	ppm/K	＜55