Polybenzoxazole (P-PSPBO)_Polybenzoxazole (P-PSPBO)

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Polybenzoxazole (P-PSPBO)

產品描述：Product Description: Photosensitive Polybenzoxazole (PSPBO) is an outstanding heat-resistant photosensitive dielectric insulating material widely used in critical fields such as microelectronics and aerospace. Its excellent photosensitivity, mechanical strength, heat resistance, insulating properties, low water absorption, and low dielectric constant make it an ideal choice for these advanced applications.

產品介紹

Product Applications

In semiconductor packaging technology, especially in Fan-Out Wafer-Level Packaging (FOWLP) and Redistribution Layer (RDL) processes, PSPBO serves as a photoresist material playing a crucial role in interlayer dielectric materials, stress buffer layers, and protective coatings. In these advanced processes, the low coefficient of thermal expansion (CTE) of PSPBO helps improve chip stability under temperature fluctuations. Its high mechanical strength enhances chip durability against physical stress, while the low dielectric constant ensures low signal loss during high-speed data transmission. The combination of these properties significantly enhances chip performance and long-term reliability under various environmental conditions.

Product Features

Low-temperature curing
Low coefficient of thermal expansion
High development resolution: film thickness/via = 5 µm / 5 µm, 10 µm / 10 µm
Low dielectric loss: Df < 0.01 @ 10 GHz
Aqueous solvent development
Excellent chemical resistance: effectively resists corrosion from various organic solvents, inorganic acids, and alkaline solutions

Product Specifications

Test Item	Unit	WLPT01-B
Exposure / Development	/
Exposure Dose	mJ/cm²	350–550
Developer	-	2.38% TMAH
Resolution (Film Thickness / Via)	µm	10/5 ; 10/10
Cure Conditions
Cure Temperature	°C	250–300
Thermal Properties
Glass Transition Temp (Tg)	°C	>300
Coefficient of Thermal Expansion (CTE)	ppm/K	<55