您好!歡迎光臨律勝科技股份有限公司
律勝科技股份有限公司

Alkaline Removable Laser Release Material

Alkaline Removable Laser Release Material

產品描述:The product is suitable for temporary bonding processes with glass carriers, especially in the RDL (Redistribution Layer) first process. Paired with a peelable coating material during the laser process, it allows the silicon wafer to be easily separated from the glass carrier after processing, and any residual adhesive can be removed with an alkaline solution.

Product Features

n High adhesiveness: It has good adhesion to metal layers (Ti/Cu).


n High chemical resistance: It can withstand photoresist agents, metal etching solutions, and organic solvents.



HLN00-PB 流程.jpg


產品特性 


項目 Item

條件 Condition

可剝聚醯亞胺

HLN00-PB

顏色型態Exterior color

-

半透明液態

去膜液 Stripping solution

-

4% NaOH/TMAH-DMSO

解黏波段 De-bondwavelength


355 nm

附著性 Adhesion

百格測試  Cross-hatch tape test

5B

熱穩定性 Thermal stability

高溫烘烤 390℃ / 60 min

無破裂/無軟化

耐化性Chemical resistance

浸泡 NMP, 90℃/10 min

膜厚無損失 No peeling

玻璃轉移溫度Tg


370

熱膨脹係數 CTE

50℃~200℃/9 min

17 ppm/K

操作厚度 Thickness


10~15 um



如需產品相關資料或詳細規格,請與我們聯繫。

 


標籤:全部
更多>>

推薦新聞

    暫無推薦內容...